Side-by-Side Comparison
Graphics Cards
HBM vs. HBM2
Comparing 2 standards across 7 specifications. 7 key differences identified.
Comparing:
HBM
HBM2
HBM (High Bandwidth Memory), standardized by JEDEC in October 2013, takes a fundamentally different approach from GDDR -- stacking multiple DRAM dies vertically and connecting them via through-silicon vias next to the GPU on a silicon interposer, trading GDDR's narrower, faster-clocked bus for a much wider, slower one. Manufacturing cost has kept it mostly in high-end compute GPUs rather than mainstream cards.
HBM2, standardized by JEDEC in January 2016, doubled HBM's maximum stack height to 8 dies and its per-pin transfer rate, reaching up to 256 GB/s of bandwidth per stack and 8GB of capacity per package.
Specification Comparison Table
7 Parameters| Parameter / Spec | ||
|---|---|---|
|
JEDEC Standard
|
October 2013 (JESD235) | January 2016 (JESD235a) |
|
Architecture
|
Vertically stacked DRAM dies, through-silicon vias (TSVs), silicon interposer | — |
|
Bus Width (4-Hi Stack)
|
1024-bit (8 x 128-bit channels) | — |
|
Typical Use
|
High-end compute/datacenter GPUs, not mainstream consumer cards | — |
|
Max Dies Per Stack
|
— | 8 |
|
Max Bandwidth / Data Rate
|
— | 256 GB/s per stack |
|
Available Capacity Range
|
— | 8GB per package |