Side-by-Side Comparison
Graphics Cards
GDDR6 vs. HBM
Comparing 2 standards across 6 specifications. 6 key differences identified.
Comparing:
GDDR6
HBM
GDDR6, standardized by JEDEC in July 2017 and reaching mass production in early 2018, doubled data rates over GDDR5 to as much as 16-18 Gbit/s per pin -- the current mainstream graphics memory standard for most non-flagship cards.
HBM (High Bandwidth Memory), standardized by JEDEC in October 2013, takes a fundamentally different approach from GDDR -- stacking multiple DRAM dies vertically and connecting them via through-silicon vias next to the GPU on a silicon interposer, trading GDDR's narrower, faster-clocked bus for a much wider, slower one. Manufacturing cost has kept it mostly in high-end compute GPUs rather than mainstream cards.
Specification Comparison Table
6 Parameters| Parameter / Spec | ||
|---|---|---|
|
JEDEC Standard
|
July 2017 | October 2013 (JESD235) |
|
Mass Production
|
January 2018 | — |
|
Max Bandwidth / Data Rate
|
Up to 16 Gbit/s per pin (18 Gbit/s in mass-production variants) | — |
|
Architecture
|
— | Vertically stacked DRAM dies, through-silicon vias (TSVs), silicon interposer |
|
Bus Width (4-Hi Stack)
|
— | 1024-bit (8 x 128-bit channels) |
|
Typical Use
|
— | High-end compute/datacenter GPUs, not mainstream consumer cards |