Side-by-Side Comparison
Processors
BGA vs. PGA
Comparing 2 standards across 6 specifications. 6 key differences identified.
Comparing:
BGA
PGA
BGA (Ball Grid Array) solders the chip directly to the board using an array of solder balls -- not a removable socket connection at all. It's common in laptops, ultra-compact devices, and embedded/mobile processors where board space and thinness matter more than the ability to swap the chip later.
PGA (Pin Grid Array) puts the pins directly on the processor package, with the socket providing holes instead -- the inverse of LGA. AMD used PGA for its mainstream desktop sockets for years, including AM4, before shifting its mainstream line to LGA with AM5 in 2022.
Specification Comparison Table
6 Parameters| Parameter / Spec | ||
|---|---|---|
|
Mounting
|
Solder balls, permanently attached to the board | — |
|
Upgradability
|
None -- requires specialized rework equipment to replace | — |
|
Typical Use
|
Laptops, ultra-compact devices, embedded and mobile processors | — |
|
Pin Location
|
— | Chip package itself; socket has holes |
|
Notable Example
|
— | AMD Socket AM4 (1331 pins) |
|
AMD Transition to LGA
|
— | Late 2022 (Socket AM5) |