Side-by-Side Comparison
Processors
BGA vs. LGA
Comparing 2 standards across 6 specifications. 6 key differences identified.
Comparing:
BGA
LGA
BGA (Ball Grid Array) solders the chip directly to the board using an array of solder balls -- not a removable socket connection at all. It's common in laptops, ultra-compact devices, and embedded/mobile processors where board space and thinness matter more than the ability to swap the chip later.
LGA (Land Grid Array) puts the pins on the socket rather than the chip -- the processor has flat contact pads instead of pins, reducing the risk of chip damage since a bent-pin problem falls on the cheaper motherboard rather than the CPU. Intel adopted it for desktop CPUs in 2004 with Socket 775.
Specification Comparison Table
6 Parameters| Parameter / Spec | ||
|---|---|---|
|
Mounting
|
Solder balls, permanently attached to the board | — |
|
Upgradability
|
None -- requires specialized rework equipment to replace | — |
|
Typical Use
|
Laptops, ultra-compact devices, embedded and mobile processors | — |
|
Pin Location
|
— | Socket (motherboard side); chip has flat contact pads ("lands") |
|
Used By
|
— | Intel (desktop/server since 2004); AMD (Threadripper, EPYC, and Ryzen since AM5, 2022) |
|
Introduced (Desktop)
|
— | 2004 (Intel Socket 775 / LGA775) |